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KMID : 0380619850170060482
Korean Journal of Food Science and Technology
1985 Volume.17 No. 6 p.482 ~ p.489
Studies on the Thermal Conductivity of Model Foods



Abstract
The model foods similar to Korean typical foods were propared by combining moisture, protein and starch, and their thermal conductivities were investigated. Thermal conductivity of the model foods had a close relationship with food components such as moisture, protein and starch content. The interaction between the thermal conductivity and food components was not found. Thermal conductivity was proportionally increased as the moisture content increased, and thermal conductivity of starch food was lower than that of protein foods under the same level of moisture content of the model foods. The regression equation between thermal condutivity of the model foods. The regression equation between thermal conductivity of the model foods and moisture, protein and starch content at 20¡É was as follows; k = 0.00421M + 0.03152P + 0.05181. Correlation coefficient between calculated by above equation and measured values showed highly significant (r = 0.8418^(**)).
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